It is used for FPC underfilling, reinforcement, mobile phone camera bonding, assembly, TWS earphone bonding, COB damming, SMT underfilling, component packaging, solder paste, red glue, black glue, semiconductor packaging, component fixing and other electronic components high-precision dispensing and spraying occasions.

This compact yet robust dispensing system features an aluminum alloy frame for lightweight durability and vibration resistance. Equipped with high-precision vision alignment (0.02mm repeatability), it ensures accurate glue dotting for PCB assembly, LED packaging, and micro-component bonding. The user-friendly touchscreen supports path programming with CAD file import. Compatible with various adhesives (epoxy, silicone, UV glue), it offers adjustable dispensing parameters (0.01-10ml/min) and ±0.5% volume control. Ideal for R&D labs and small-batch production, the machine includes an anti-drip valve and quick-change syringe holder for efficient operation.