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Dispensing Solder Paste WS70 is a water-soluble (washable), halide-free halogen-optional formulation designed specifically for high-reliability dot and line dispensing. Unlike traditional stencil printing pastes, dispensing solder pastes demand highly specialized rheological characteristics. The viscosity must dynamically decrease under shear stress (during the pressure stroke inside the syringe barrel) to permit micro-deposits, while recovering instantly (thixotropic recovery) upon deposit to avoid structural slump or bleeding.
The chemistry of WS70 revolves around a highly purified organic acid water-wash flux platform. It utilizes a synthetic gel system combined with active yet safe organic activators that exhibit exceptional oxide clearance kinetics at peak reflow profiles. Crucially, the organic residues left behind after reflow are completely soluble in standard water loops without the need for solvent-based cleaners or saponifiers. This characteristic dramatically lowers overall volatile organic compound (VOC) emissions during cleaning and mitigates hazardous waste disposal expenses.
Features a tailored thixotropic index preventing tailing, dripping, or satellite droplets when coupled with pneumatic or piezoelectric jetting systems.
Maintains consistent viscosity profiling and minimizes needle clogging during continuous production shifts of up to 16 hours without dry-out.
The organic flux formulation ensures any post-reflow residue is benign after hot DI water rinsing, preventing dendritic growth and electrochemical migration.
| Property Parameter | Typical Values (WS70 Series) | Standards / Test Methods | Operational Advantages |
|---|---|---|---|
| Alloy Composition | Sn96.5 / Ag3.0 / Cu0.5 (SAC305) | IPC-J-STD-006 | Global lead-free industry benchmark; robust mechanical strength |
| Powder Size Distribution | Type 4 (20-38µm) & Type 5 (15-25µm) | IPC-TM-650 (2.2.14) | Allows micro-nozzle dispensing down to 0.15mm inner diameters |
| Viscosity (Malcom) | 160 - 220 Pa·s (at 10 rpm, 25°C) | IPC-TM-650 (2.4.34.3) | Optimal extrusion pressure with zero nozzle clogging or tailing |
| Flux Classification | ORH0 (Water-Soluble, Halide-Free) | IPC-J-STD-004B | Safe for medical and automotive high-reliability electronics |
| Voiding Rate | < 8% (Typical surface area voiding) | IPC-TM-650 (2.6.3.7) | Superior thermal transfer for RF and high-power LED arrays |
For modern electronics manufacturing operations running in high-compliance jurisdictions, obtaining equipment and consumable chemistry with verifiable CE certification is paramount. Our WS70 dispensing solder paste is produced in facilities that adhere closely to EU directives, guaranteeing total compliance with environmental safety and health frameworks.
Specifically, the CE Certification on our compounding and packaging processes certifies that the chemical compounds conform to the essential requirements of RoHS (Restriction of Hazardous Substances) Directive 2011/65/EU and REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) standards. This guarantees that elements like Lead, Cadmium, Polybrominated Biphenyls (PBB), and Mercury are maintained well below limits, protecting end consumers and simplifying global market clearance.
Additionally, compliance with the DIN EN ISO 9001:2015 standard in our production facility ensures that each batch of solder paste exhibits uniform grain size distributions and consistent rheology, which are documented in safety data sheets (SDS) and certificates of analysis (COA) provided with every delivery.
How major industrial regions implement WS70 Solder Paste to solve real-world micro-electronics challenges.
In major SMT manufacturing clusters around Hanoi and Ho Chi Minh City, assembly shops utilize WS70 for shielding-can attachments and micro-BGA components. Due to the high ambient humidity of the region, the robust chemical stability of WS70 prevents pre-reflow moisture absorption, maintaining low voiding rates even under high-humidity production environments.
Automotive electronics manufacturers in Monterrey and Guadalajara rely on WS70 for sensor packages and electronic control units. The requirement for zero ionic contamination leads engineers to wash residues under pressurized hot deionized water loops. WS70's clean rinsability leaves zero trace residues, eliminating electrical leakage risks during high-stress operation.
Morocco's emerging aerospace industrial parks require high-reliability solder joints capable of surviving vibration. WS70 provides void-free joint structures under SAC305 reflow profiles. Crucially, the formulation ensures zero halogen residues, fulfilling aerospace standard requirements for safety in flight-critical modules.
Shenzhen Anyco Automation Equipment Co., Ltd., established in 2013, is a national high-tech enterprise integrating research and development, manufacturing, sales, and post-sale engineering for automated fluid control systems and precision consumables. Headquartered in Guanlan, Shenzhen, with our specialized production factory in Huizhou, we occupy a modern facility spanning over 2,000 square meters.
By combining advanced equipment production (precision industrial dispensing injection valves, desktop automation robots) with high-quality consumables like the WS70 solder paste series, we offer a comprehensive one-stop integration. Our geographic positioning in the heart of China’s electronic manufacturing hub allows us to secure highly stable raw materials, from high-purity spherical solder powders to customized polymer syringe barrels.
This vertical integration ensures excellent cost efficiencies and logistics support. While western supply chains face delays, Anyco maintains a rolling buffer stock of raw ingredients and packaging configurations. Whether you require custom syringe volume fills (from 30cc up to 500cc) or custom viscosity tuning for specialized valve heads, our R&D facility in Shenzhen is equipped to customize and ship within industry-leading lead times.
As consumer devices continue to demand higher processing power in smaller physical footprints, SMT assembly is shifting from traditional printing methods to advanced micro-dispensing and jetting. The technical roadmap for Anyco's WS70 series focuses on solving the challenges associated with these trends:
Future iterations of WS70 are targeting Type 6 and Type 7 solder powders. By utilizing narrow distribution range powders, engineers can dispense solder paste through ultra-fine needles down to 100 microns without clogging. This allows reliable prototyping of 01005 passives and ultra-fine pitch wafer-level CSPs.
Additionally, we are developing advanced organic vehicle formulations to improve wet tackiness. This helps prevent component shift during high-acceleration pick-and-place cycles, ensuring high-yield assembly on modern, high-speed lines.
Ensuring seamless logistics, cold chain compliance, and technical support across worldwide assembly hubs.
Solder paste requires continuous temperature-controlled transit to prevent flux separation and premature aging. Anyco offers verified cold chain shipping solutions, utilizing gel ice packs and insulated containers with real-time temperature data logging, ensuring the product arrives in optimal condition.
Our application engineers are available to support your assembly line setups. Whether you are dialing in the parameters for a piezoelectric jetting valve or troubleshooting reflow profile issues, we provide process parameters, thermal profiling assistance, and optimization advice.
We configure packaging configurations, custom syringe options, specific thixotropic indices, and custom metal load weights to meet your production line's precise specifications.
Expert answers to common engineering, process integration, and logistical questions.
WS70 should be stored vertically with the syringe tip pointing downwards at a controlled temperature of 2°C to 10°C (36°F - 50°F). Storing it at this temperature prevents flux separation and extends the product shelf life up to 6 months from the date of manufacture. Prior to dispensing, the paste must be allowed to naturally reach ambient room temperature (typically 19°C - 25°C) for at least 2 to 4 hours. Do not heat the syringe artificially, as this will degrade the flux binders.
Yes. The WS70 series features a highly stable thixotropic index specifically engineered for high-frequency jetting processes. It handles the continuous high shear stress inside the fluid chamber of piezoelectric jetting valves without polymer chain shearing, preventing dripping and ensuring consistent dot volume deposits over long production runs.
WS70 flux residues can be washed using pressurized deionized (DI) water. The ideal wash parameters are water temperatures of 45°C - 60°C (113°F - 140°F) at a spray pressure of 40 - 60 PSI. A final rinse with clean DI water, followed by a hot air blow-dry step, is recommended to ensure zero ionic contamination remains on the board.
WS70 is formulated with active organic oxygen scavengers that perform exceptionally well in a standard air atmosphere reflow cycle. While reflowing in Nitrogen (N2) with low oxygen levels (< 100 ppm) will improve wetting on challenging, oxidised surfaces, it is not required for standard copper-OSP, ENIG, or HASL surface finishes.
For needle inner diameters down to 0.25mm, Type 4 powder (20-38µm) is standard. For finer needles, down to 0.15mm inner diameters, Type 5 powder (15-25µm) is recommended to prevent clogging. A general guideline is to ensure the dispensing nozzle's inner diameter is at least 6-7 times larger than the average particle diameter of the solder powder.
Complete your production line integration with our performance-matched jet valves, curing systems, and static mixing accessories.
Anyco Automation