CE Certification High-speed 3250 Solenoids for Microphone Dispensing Factories, Companies

Weight Valve Body 250g  controllers  1350g

Valve Body Size

MDV 3250+FC

92.1*41.5*25mm

controllers  Size

MDC 3290+

128*102*173mm

Product Description

Technical Specifications
Dispensing Volume
Minimum 0.8 nl single dot
Minimum Dot Diameter
170 µm
Spray Pressure
1-1000 bar (adjustable)
Frequency
Up to 3000 Hz
Optional Heating System
Controllable nozzle heating: 180°C
Standard Interfaces
RS-232C; 24V/5 V PLC, AUX
Power Supply Access
110/230 V AC, 50/60 Hz Power connector
Key Features & Capabilities
High-Speed Piezoelectric Technology
  • High-speed piezo technology speeds up the dispensing cycle.
  • Provides ultra-fast opening/closing of the valve.
  • Accurate and reproducible jet dispensing results.
  • Equipped with a high-performance piezoelectric actuator.
  • Ultra-high needle lift and force make it particularly suitable for dispensing high-viscosity fluids.
Fast Tip Calibration Configuration
  • The latest tip calibration design reduces needle and nozzle calibration time.
  • Enables fast top calibration configuration.
Ultra-Precise Non-Contact Dispensing
  • Designed to meet a wide range of fluid viscosities (up to 2 million mPas).
  • Consistent lightweight design maximizes dispensing accuracy.
  • Delivers highly consistent dispensing of single dots (as small as 0.8 nanoliters) or beads.
  • Error values (CV) are kept as low as 1%.
Cost Savings & Maintenance
  • Cost savings due to freely available needles, nozzles, and new or used accessories.
  • Modular valve body design separates wet and dry zones for fast and safe replacement of wet zone parts.
  • Easy and fast cleaning and replacement of accessories reduces system downtime.
Wide Range of Applications
  • Modular design makes the MDS3250+FC Series suitable for a wide range of user-defined applications.
  • Customizable connecting wires designed to reduce overall space requirements.
  • Ultra-wide range of applications.
Advanced Control & Compatibility
  • Valve Memory Expansion: The MDV3250+FC features four times the memory space compared to the MDV3200A. The MDC3290+ provides storage for application-related information.
  • Fully Compatible: Works with all standard consumables and spare parts for maximum flexibility, including earlier XY axis dispensing systems.
  • Selectable Pin/Program Mode: Allows spot size and speed to be changed at any time during the dispensing process. Programmable Program Mode is available for virtually any application requirement.
Frequently Asked Questions
What is the minimum dispensing volume of the MDV3250+FC series?
The system supports a minimum dispensing volume of 0.8 nanoliters for a single dot, with a minimum dot diameter of 170 µm.
How does the piezoelectric technology benefit the dispensing process?
High-speed piezoelectric technology accelerates the overall dispensing cycle by allowing ultra-fast opening and closing of the valve, which ensures highly accurate and reproducible jet dispensing results.
What maximum fluid viscosity can this non-contact jet dispensing system handle?
The system features an ultra-precise non-contact design capable of dispensing high-viscosity fluids with values up to 2 million mPas.
How does the modular design contribute to maintenance and cost savings?
The modular valve body design separates the wet and dry zones, allowing fast and safe replacement of wet zone components. This reduces cleaning time, limits downtime, and lets you use freely available needles, nozzles, and accessories to lower operational costs.
What memory improvements does the MDV3250+FC valve offer?
The MDV3250+FC valve features four times the memory space of the MDV3200A. Additionally, the paired MDC3290+ controller provides expanded storage space for complex application-related data.
What are Pin and Program Modes?
Selectable Pin and Program Modes allow operators to dynamically change the spot size and dispensing speed at any time during the process. The programmable Program Mode is customizable to suit virtually any specific application requirement.

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